委託分析詳細

As semiconductor device line widths continue to shrink, process conditions and specifications have become increasingly stringent, making wafer surface contamination control more critical than ever. Volatile organic compounds (VOCs) released from polymers used in the manufacturing process, as well as inorganic contaminants originating from ultrapure water or chemical agents, may remain on wafer surfaces and lead to yield loss. Through advanced analytical technologies, such surface contamination issues can be effectively detected and evaluated.